New Product/Process Development


New Product/Process Development. New Product/Process Development. New Product/Process Development. New Product/Process Development.

Customer Request

    • Printed Wire Boards
    • Components
    • Material
    • Plating integrity
    • Assembly

    Tests/Analyses Involved

    • Visual inspection
    • Thermal stress (solder flow)
    • Cross-sectioning
    • Light and scanning electron microscopy
    • DSC and TGA


       416-899-1882
       647-495-8727
       info@sentec.ca

    SENTEC Testing Laboratory Inc.
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